Process Engineer - hivac

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Tower Semiconductor is a global specialty foundry leader! We specialize in manufacturing analog integrated circuits for more than 300 customers worldwide in growing markets such as automotive, medical, industrial, consumer and aerospace and defense, among others.

Responsible for sustaining and developing process recipes on AMAT Centura platforms for HTF Poly deposition and/or AMAT Radiance RTP platforms for all released semiconductor-related processes. The position would include Wafer Fab trouble shooting Bipolar and CMOS issues, monitoring key process parameters, Promis PROD and specification updates. Must provide E-test data analysis, performance failure analysis on parametric failures and low-yielding issues and provide feedback to other engineers and management to improve the manufacturing process.

• Some technical background preferred in AMAT Centura platforms for HTF Poly and AMAT Radiance RTP platforms.
• Some technical background to develop and sustain 0.35 to 0.13um RFCMOS/SiGe BiCMOS processes.
• Understanding and experience in direct application of statistical process control.
• Work closely with device, integration, and yield engineers in a matrixed organization to drive leading edge modules development, control, and improvements.
• Investigate and verify activities for both issues reported by Yield and equipment-induced process impacts
• Interface with Process Technicians to verify response to daily issues and assist with priority and held lots
• Create PROD requests as required (assist other engineers) to enhance/maintain Promis lot processing and specifications
• Create/implement improvements to existing processes such as variable DCOPs, HTF & RTP recipe optimization
• Analyze E-test data, disposition problem wafers/lots, use statistical process control techniques to improve yields, and provide corrective action recommendations to solve E-test issues
• Utilize advanced analytical tools and techniques to solve wafer fabrication problems
• Participate in teams to solve technical manufacturing problems
• Write HTF & RTP Operation procedures, specifications, and documentation
• Develop tools and techniques to improve failure analysis capability
• Analyze and recommend capital equipment requirements for analytical tool purchases

Assignment Complexity

• Work assignments are moderately complex in nature; define problems, collect data, establish facts, and draw valid conclusions.

Accountability/Discretion

• To assume responsibility for a definable tool set and related projects. In addition will define and lead projects for HIVAC area.

Financial Responsibilities

• Engineering assignments have varying financial impact on the business performance. Errors can be corrected but may cause delays.

Technical Expertise

• Knowledge of scientific concepts and expertise in one or more technical areas are required to enable more complex assignments involving some analysis and decision making in areas of technical expertise.

Working Relationships

• Regularly work with all levels of employees within the company and external individuals. Position also provides technical guidance to others.

Supervision

• Does not have management responsibilities, expect some supervision of projects.

Working Conditions

• Normal office conditions and works in fab. Must be able to work in a standard clean room fab environment.

• Some knowledge in one or both of the following: AMAT Centura platforms for HTF Poly deposition and AMAT Radiance RTP platforms.
• General knowledge of Bipolar, CMOS or other semiconductor technologies.
• Analytical problem-solving skills required as well as ability to effectively communicate technical data and findings to management and colleagues.
• Sustained ownership of day-to-day operations and mentoring technicians. Bachelor's degree required. Advanced degree, MS, or Ph.D., in Chemistry, Materials Science or Electrical Engineering preferred.

$78,850-$145,122