Thin Films Process Development Engineer
 SkyWater Technology | |
life insurance, paid time off, paid holidays, 401(k)
| |
 United States, Florida, Kissimmee | |
| 200 NeoCity Way (Show on map) | |
 Feb 05, 2026 | |
|
Bold Thinking. World Changing. At SkyWater, our ingenuity helps improve lives around the world by manufacturing U.S. made semiconductors that are essential ingredients of modern life. Automotive safety enhancements, life-saving medical devices, consumer electronics and American security require semiconductors. Working in our Minnesota headquarters, Florida, or Texas location - employees join together to improve the world.
Explore what's possible. Joining our U.S. - based team means contributing to and learning about the commercialization of some of the most exciting technologies the world has ever seen. We are turning "science fiction" into everyday reality through technologies such as superconducting, 3D integrated circuits or computer chips, carbon nanotubes, photonic logic devices, micro electro-mechanical systems and other emerging device topologies. We manufacture products for aerospace and defense, medical, automotive, consumer and industrial markets, to name a few. Our customers include emerging leaders who rely on our intellectual property security and quality manufacturing services.
Step into the future. SkyWater's values of Integrity, Excellence, Collaboration, Empowerment and Growth Mindset guide us to cultivate an empowered, learning environment. We also invest in developing highly skilled, dedicated employees - and employees who are entering the workforce for the first time, from the military, and a variety of educational backgrounds.
Are you bold thinking? Find your place on our team and help us change the world!
Position Summary: We are looking for a hardworking and passionate Thin Films Process Development Engineer for our Florida Advanced Packaging Fab. In this role you will lead, develop and improve Thin Films processes for integrated Advanced Packaging process flows and Heterogenous Integration (HI) platform technologies such as Hybrid Bonding and Direct Bond Interconnect (DBI), 2.5D and 3D Interposer, and Fan-Out Wafer Level Packaging (FOWLP). Excellent oral and written communication skills are required to effectively and efficiently communicate ideas with foundry customers, colleagues, and management. Responsibilities: * New process development/transfer/integration/ownership in a manufacturing environment. * Develop or integrate robust manufacturable process recipes for Foundry customers in PECVD and/or metal thin films deposition (including reactive PVD). * Develop and control thin film processes optimized for product required film stress, thickness, optical properties. * Work in a team for process integration of advanced packaging solutions for platform Heterogenous Integration technologies and unique customer applications. * Utilize metrology tools to characterize and document process results for transfer to production. * Investigate and drive integration changes for improved device performance and yield improvement. * Lead a team or work with process integration and tool engineers to find processing marginalities and make improvements. * Routinely monitor selected in-line and end-of-line SPC charts for trends or excursions that can be addressed by integration changes. * Act as a team leader and area owner for your unit process modules. The job also requires performing other duties as assigned. Percentages of time spent on job duties are estimates and may vary for each position. Required Qualifications: Education: BS Engineering, MS/PhD preferred. Physics, Electrical Engineering, Materials Science or equivalent. Experience and Skills: * Back-end-of-line (BEOL) or front-end-of-line (FEOL) fab processing tools knowledge/experience. * 7-10 years experience with BS, 5-7 years experience with MS, 2+ years experience with PhD * MEMS, Photonics, or CMOS fabrication experience a plus. * Expert in process development for PECVD dielectrics (silicon oxides and nitrides). * Experience in PVD for metal thin films in damascene and TSV (through silicon via) seed layers is a plus. * Proficient in DOE and SPC. Knowledge of 6-sigma concepts and applications. * Clear problem-solving capability, data driven, inventive solution oriented and can articulate thought processes. * Can work both independently and in (or lead) cross-functional teams for problem solving. US Citizenship Required: This position will require the holding of or ability to obtain government security clearance which requires U.S Citizenship. The annual salary range for this role is $114,320 - $171,480. Pay offered is based on many factors including, but not limited to, the job-related experience, skills, education, and credentials of each candidate. Additionally, SkyWater offers a comprehensive benefits package which promotes a healthy life. This includes benefit eligibility day one, medical, dental, mental health benefits, vision, legal planning, short- and long-term disability, paid time off, paid holidays, an on-site fitness facility, and an on-site self-serve market. SkyWater complies with federal and state disability laws and makes reasonable accommodations for applicants and employees with disabilities unless doing so would cause an undue hardship. Alternative methods of applying for employment are available to individuals unable to submit an application through this site because of a disability. To request reasonable accommodations, to participate in the job application or interview process, to perform essential job functions, and/or to receive other benefits and privileges of employment, please contact Human Resources at 952-851-5200 or Recruiting@SkyWatertechnology.com. EOE, including disability/vets | |